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| TECHNICAL DATA IN74HC175A Quad D Flip-Flop with Common Clock and Reset High-Performance Silicon-Gate CMOS The IN74HC175A is identical in pinout to the LS/ALS175. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. This device consists of four D flip-flops with common Reset and Clock inputs, and separate D inputs. Reset (active-low) is asynchronous and occurs when a low level is applied to the Reset input. Information at a D input is transferred to the corresponding Q output on the next positivegoing edge of the Clock input. * Outputs Directly Interface to CMOS, NMOS, and TTL * Operating Voltage Range: 2.0 to 6.0 V * Low Input Current: 1.0 A * High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION IN74HC175AN Plastic IN74HC175AD SOIC TA = -55 to 125 C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs Reset PIN 16=VCC PIN 8 = GND L H H H X = Don't care L Clock X D X H L X Outputs Q L H L Q H L H no change Rev. 00 IN74HC175A MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 20 25 50 750 500 -65 to +150 260 Unit V V V mA mA mA mW C C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/C from 65 to 125C SOIC Package: : - 7 mW/C from 65 to 125C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V C ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or VOUT)VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74HC175A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions V Guaranteed Limit 25 C to -55C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.1 8.0 85 C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 1.0 80 125 C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 1.0 160 A A V Unit VIH Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage VOUT=0.1 V or VCC-0.1 V IOUT 20 A VOUT=0.1 V or VCC-0.1 V IOUT 20 A VIN=VIH or VIL IOUT 20 A VIN=VIH or VIL IOUT 4.0 mA IOUT 5.2 mA 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 V VIL V VOH V VOL Maximum LowLevel Output Voltage VIN= VIL or VIH IOUT 20 A VIN= VIL or VIH IOUT 4.0 mA IOUT 5.2 mA IIN ICC Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) VIN=VCC or GND VIN=VCC or GND IOUT=0A Rev. 00 IN74HC175A AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns) VCC Symbol Parameter V Guaranteed Limit 25 C to -55C 6.0 30 35 150 30 26 125 25 21 75 15 13 10 85C 125C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Maximum Propagation Delay, Clock to Q or Q (Figures 1 and 4) Maximum Propagation Delay , Reset to Q or Q (Figures 2 and 4) Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Input Capacitance Power Dissipation Capacitance (Per Flip-Flop) 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 - 4.8 24 28 190 38 33 155 31 26 95 19 16 10 4.0 20 24 225 45 38 190 38 32 110 22 19 10 MHz tPLH, tPHL ns tPHL, tPLH ns tTLH, tTHL ns CIN pF Typical @25C,VCC=5.0 V 35 pF CPD Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns) VCC Symbol tSU Parameter Minimum Setup Time, Data to Clock (Figure 3) Minimum Hold Time, Clock to Data (Figure 3) Minimum Recovery Time, Reset Inactive to Clock (Figure 2) Minimum Pulse Width, Clock (Figure 1) Minimum Pulse Width, Reset (Figure 2) Maximum Input Rise and Fall Times (Figure 1) V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 25 C to -55C 100 20 17 3 3 3 100 20 17 80 16 14 80 16 14 1000 500 400 Guaranteed Limit 85C 125 25 21 3 3 3 125 25 21 100 20 17 100 20 17 1000 500 400 125C 150 30 26 3 3 3 150 30 26 120 24 20 120 24 20 1000 500 400 Unit ns th ns trec ns tw ns tw ns tr, tf ns Rev. 00 IN74HC175A Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Test Circuit EXPANDED LOGIC DIAGRAM Rev. 00 IN74HC175A N SUFFIX PLASTIC DIP (MS - 001BB) A Dimension, mm 16 9 B Symbol A MIN 18.67 6.1 MAX 19.69 7.11 5.33 1 8 B C F L D F 0.36 1.14 2.54 7.62 0 2.92 7.62 0.2 0.38 0.56 1.78 C -T- SEATING PLANE G H H J N G D 0.25 (0.010) M T K M J K L M N 10 3.81 8.26 0.36 NOTES: 1. Dimensions "A", "B" do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. D SUFFIX SOIC (MS - 012AC) Dimension, mm A 16 9 Symbol A MIN 9.8 3.8 1.35 0.33 0.4 1.27 5.72 0 0.1 0.19 5.8 0.25 MAX 10 4 1.75 0.51 1.27 H B P B C 1 G 8 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEATING PLANE J F M H J K M P R 8 0.25 0.25 6.2 0.5 NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B 0.25 mm (0.010) per side. Rev. 00 |
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